Search
Now showing items 1-2 of 2
Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present work studies the mechanical properties of mechanically polished gold wire and wirebond using nanoindentation. Metallography of wirebond reveals undesirable coarse grain structure in HAZ ...
Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of the flip chip package is strongly influenced by underfill, which has a much higher coefficient of thermal expansion (CTE) compared with other packaging materials and leads ...